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1

Characterization of nanoscaled solder material

Andrej Novikov, Mathias Nowottnick

Journal:

physica status solidi (a)

Year:

2012

Language:

english

File:

PDF, 724 KB

english, 2012

2

Energy and Geometry of Cooperative Hydrogen Bonds in p-Substituted Calix[n]- and Thiacalix[n]arenes: A Quantum-Chemical Approach

Novikov, Andrej N., Shapiro, Yury E.

Journal:

Journal of Physical Chemistry A

Year:

2012

Language:

english

File:

PDF, 3.06 MB

english, 2012

3

[IEEE 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO) - Birmingham, United Kingdom (2012.08.20-2012.08.23)] 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO) - Low-temperature assembling process with nanoscaled solder layers

Novikov, Andrej, Holzhuter, Gerd, Nowottnick, Mathias

Year:

2012

Language:

english

File:

PDF, 1.42 MB

english, 2012

4

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Nanoscaled solder for low-temperature assembling processes

Novikov, Andrej, Nowottnick, Mathias

Year:

2010

Language:

english

File:

PDF, 1.65 MB

english, 2010

5

Exit Times of Diffusions with Incompressible Drift

Iyer, Gautam, Novikov, Alexei, Ryzhik, Lenya, Zlatoš, Andrej

Journal:

SIAM Journal on Mathematical Analysis

Year:

2010

Language:

english

File:

PDF, 525 KB

english, 2010

6

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Synthesis and characterization of nanoscaled solder material

Novikov, Andrej, Nowottnick, Mathias

Year:

2012

Language:

english

File:

PDF, 3.28 MB

english, 2012

7

\(L_1\)-space for a positive operator affiliated with von Neumann algebra

Novikov, Andrej

Journal:

Year:

2017

Language:

english

File:

PDF, 764 KB

english, 2017

8

[IEEE 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Sofia, Bulgaria (2017.5.10-2017.5.14)] 2017 40th International Spring Seminar on Electronics Technology (ISSE) - Material study for full-faced heating layers, integrated in printed circuit boards

Seehase, Dirk, Lange, Fred, Novikov, Andrej, Nowottnick, Mathias

Year:

2017

Language:

english

File:

PDF, 866 KB

english, 2017

9

[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Phase Change Materials for Thermal Peak Management Applications with Specific Temperature Ranges

Maxa, Jacob, Novikov, Andrej, Nowottnick, Mathias, Heimann, Matthias, Jarchoff, Kay

Year:

2018

Language:

english

File:

PDF, 753 KB

english, 2018

10

[IEEE 2018 41st International Spring Seminar on Electronics Technology (ISSE) - Zlatibor, Serbia (2018.5.16-2018.5.20)] 2018 41st International Spring Seminar on Electronics Technology (ISSE) - Endogenous Heating of Printed Circuit Boards by Means of Electromagnetic Induction on Suitable Susceptors

Seehase, Dirk, Kohlen, Christian, Neiser, Arne, Novikov, Andrej, Nowottnick, Mathias

Year:

2018

Language:

english

File:

PDF, 844 KB

english, 2018

11

[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Resistance development on embedded heating layers during climatic test

Seehase, Dirk, Novikov, Andrej, Nowottnick, Mathias

Year:

2017

Language:

english

File:

PDF, 1.56 MB

english, 2017

12

[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Thermal peak management using organic phase change materials for latent heat storage in electronic applications

Maxa, Jacob, Novikov, Andrej, Nowottnick, Mathias

Year:

2017

Language:

english

File:

PDF, 1.13 MB

english, 2017

13

Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

Maxa, Jacob, Novikov, Andrej, Nowottnick, Mathias

Journal:

Year:

2017

Language:

english

File:

PDF, 12.21 MB

english, 2017

14

[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - PCM-based Thermal Buffer Coating for High Temperature Applications

Maxa, Jacob, Novikov, Andrej, Nowottnick, Mathias, Heimann, Matthias, Jarchoff, Kay

Year:

2018

Language:

english

File:

PDF, 599 KB

english, 2018

15

Selective Soldering on Printed Circuit Boards with Endogenous Induction Heat at Appropriate Susceptors

Seehase, Dirk, Kohlen, Christian, Neiser, Arne, Novikov, Andrej, Nowottnick, Mathias

Journal:

Periodica Polytechnica Electrical Engineering and Computer Science

Year:

2018

File:

PDF, 1.75 MB

2018

16

[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Potential of BiSn solders for high-temperature electronics

Novikov, Andrej, Nowottnick, Mathias

Year:

2018

File:

PDF, 4.94 MB

2018

17

[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Thermal Characterization of Endogenously Heated Printed Circuit Boards with Embedded Resistive Layers

Seehase, Dirk, Neiser, Arne, Lange, Fred, Novikov, Andrej, Nowottnick, Mathias

Year:

2018

Language:

english

File:

PDF, 38 KB

english, 2018

18

[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Alternative Heating Methods for Printed Circuit Boards and a Practical Comparison of Direct Resistance and Inductive Heating Processes

Seehase, Dirk, Neiser, Arne, Maxa, Jacob, Lange, Fred, Novikov, Andrej, Nowottnick, Mathias

Year:

2019

File:

PDF, 1.28 MB

2019